愛迪生 [金牌獎] 的 AI & AOI 視覺辨識技術挑戰 玻璃基板 - TGV（Through Glass Via，玻璃穿孔）AI 視覺檢測 AI & AOI Vision Inspection Challenges from an Edison Gold Award Winner Glass Substrate – TGV (Through Glass Via) AI Inspection 隨著AI技術的發展，半導體製程進入2nm~1.6nm ，傳統基板臨物理極限(高溫翹曲與訊號損耗及佈線密度)。玻璃基板憑藉其優異的機械穩定性、熱膨脹係數小及適合高佈線密度等特性，與傳統的 TSV（矽穿孔）相比，TGV 具備更優異的絕緣性、更低的高頻訊號損耗及成本優勢，被視為未來 AI 晶片封裝 的關鍵戰場，成為下世代封裝技術的首選。 Driven by AI technology, semiconductor nodes are entering 2nm–1.6nm. Traditional substrates face physical limits like high-temp warpage, signal loss, and density bottlenecks. Glass substrates overcome these with superior mechanical stability, low thermal expansion, and high routing density. Compared to TSV, TGV offers better insulation, lower high-frequency loss, and cost efficiency—positioning it as the key battlefield and top choice for next-gen AI chip packaging. TGV 製程中「穿孔」的孔徑越來越小（5um~100um），深寬比越來越高（10~30）。 常見製程缺陷： 包含崩角、破裂、孔洞偏移、未貫穿、側壁粗糙度、異物、化劑汙染...等。 透明玻璃材質的高透光性與折射特性，傳統基板的AOI視覺檢測設備，已無法檢查具備光學特性的玻璃基板，面臨設備汰舊換新。 In TGV manufacturing, via diameters are becoming increasingly smaller (5µm to 100µm) with progressively higher aspect ratios (10:1 to 30:1). Common process defects include chipping, cracking, via misalignment, incomplete penetration, sidewall roughness, foreign contamination, and chemical residue. Due to the high transparency and refractive properties of glass materials, conventional AOI (Automated Optical Inspection) systems designed for traditional substrates can no longer inspect optical-grade glass substrates, creating an urgent market demand for equipment replacement and upgrades. 岳揚智控 AI & AOI 視覺檢測技術，獲得兩項國際研發與創新大獎 2025 Edison Awards [金牌] 與 2024 R&D 100 Awards，更具備光學材料 (面板玻璃、光學膜片、光學鏡片與鏡頭...等) 檢測設備豐富的開發經驗，在光學取像與AI&AOI視覺演算法技術獲得國際大廠訂單。 開發特殊光譜與光路設計，結合２Ｄ影像量測技術 與 滾動式的 AI 影像辨識技術，實現高ＣＰ值非接觸式玻璃基板TGV 製程的高速精準的瑕疵檢驗。 Powered by its cutting-edge AI & AOI visual inspection technology, AI Machine Vision Corp. (AIMV) has been honored with two prestigious international R&D and innovation accolades: the 2025 Edison Award [Gold Winner] and the 2024 R&D 100 Award. Backed by extensive experience in developing inspection equipment for optical materials (including display glass, optical films, optical lenses, and camera modules), the company has earned orders from major global manufacturers for its advanced optical image acquisition and AI/AOI vision algorithms. By developing proprietary spectrum and light path designs—combined with 2D metrology and continuous online AI image recognition—AIMV achieves high-speed, high-precision, non-contact defect inspection for glass substrate TGV processes at a highly cost-effective value proposition. AI & AOI 視覺檢測 雷射改質與侵蝕後，TGV 「通孔」檢測圖 AI & AOI Vision Inspection: TGV Via Inspection Diagram (Post Laser Modification & Etching) 【您的品質，值得世界級的 AI 守護】 岳揚智控已準備好將愛迪生金獎級的ＡＩ視覺辨識技術，部署到您的 玻璃基板-TGV 製程品質檢測產線。 [立即預約諮詢] E-Mail : service@ai-machinevision.com TEL : 04 - 2491 2151 | 
